Everyone who solderers should have some in their kit!

SMARTES DESIGN

New technical support, the unique chemical formula provides excellent wetting to ensure high reliability. Adapted to the mobile phone repair industry, the computer digital service industry and high-precision SMT / BGA soldering processes for soldering printed circuit boards.

PCB/BGA DEDIZIERT
High-end quality, unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.

WIDELY APPLICABLE

The residue is colorless and transparent, does not affect detection, is unique and offers brilliant cleaning performance. Use of efficient energy thixotropy agents, pressure and preheating collapse, special solders ensure good pressure and a fine pattern.

REVOLUTIONARY DURABILITY

Wetting, anti-dry, relatively long shelf life at room temperature. Unique high quality solder paste, fine and flexible packaging (10 CC / support), filigree appearance.

What is Solder Paste?

Solder paste is a new type of solder material that comes with SMT.
Solder paste is a complex system consisting of a paste, solder powder, flux and other additives.
At normal temperature, the solder paste has a certain viscosity and the electronic component can initially adhere to a predetermined position.
At the soldering temperature, the soldered component and the circuit board are soldered together with evaporation of the solvent and some additives (permanent connection).

Preservation method:

The solder paste should be kept at 1-10 ℃.
Before opening, the temperature of the solder paste should be up
Ambient temperature (25 ° C) can be increased and the Temperature fallback time should be around 3-4 hours.
The solder paste should be used for 6 months.
The solder paste should not be placed in the sun.

Precautions:

Use only with adequate ventilation.
The solder paste contains an organic solvent. Repeat the contact with the skin. If the solder paste gets on your skin, wipe it off with alcohol and then rinse it off thoroughly with water.
Avoid contact with the eyes.
Keep away from children.

Specification

Length: 102 mm
Weight: 38.5g
Package includes: 1 * Sn63Pb37 (with lead mean temperature) 35g + 1 * printhead + 2 * needles

Notes

Due to manual measurements, please allow slight measurement deviations.
Due to the different display and lighting effects, the actual color of the item may be slightly different from the color displayed in the picture.

35g BGA Syringe Tin Solder Paste Leaded Sn63pb37 Melting Point 183 ℃🔥HOT SALE🔥

Quantity